What is the difference between mcpcb and FR4 pcb?

What is the difference between mcpcb and FR4 pcb?

The heat transfer speed of MCPCB is 8 to 9 times that of FR4 circuit board. These metal core laminates keep heat-generating components cooler by dissipating heat at a faster rate. The dielectric material should be kept as thin as possible so that it forms the shortest path from the heat source to the metal backplane. This helps dissipate heat faster. The thickness of the dielectric material will typically be in the range of 0.0762mm to 0.1524mm. So, what is the difference between metal core PCB and FR4 circuit board?

Conductivity:
MCPCB has higher thermal conductivity, typical value -1W/mK-7W/mK; FR4 circuit board has low thermal conductivity, typical value -0.3W/mK-0.4W/mK.

Thickness:
MCPCB thickness variations are limited and depend on available backplane thickness and dielectric sheet thickness; FR4 circuit boards are available in a variety of thicknesses.

Heat Dissipation:
Metal core PCBs will quickly dissipate heat and eliminate heat transfer vias; FR4 circuit boards have lower heat transfer rates and involve vias for heat transfer.

Plated Through Holes:
MCPCBPTH is not available in 1-layer PCBs where components are surface mounted; FR4 boards implement PTH.

Processing Process:
MCPCB involves the same standard process, except that the v-cutting process includes a diamond-coated saw blade for cutting metal; FR4 circuit board is a standard processing process including drilling, milling, v-cutting, and copper sinking.

Solder Mask:
MCPCB is white and is only used on the top layer; FR4 circuit boards come in many colors, such as green, red, blue and black.

Rigidity:
MCPCB can withstand shock and vibration and is 2 to 4 times stiffer than FR4 or polyimide designs; FR4 circuit boards are less rigid than metal cores.

Economy:
Metal core PCBs are more expensive than FR4 circuit boards, and FR4 circuit boards are cheaper.

mcpcb, FR4,