First Article Test
First Article Test（FAT） is a quality control practice checking the first sample soldering before the production run. The significance of FAT includes checking quality assurance and process validation.

AOI (Automated Optical Inspection)
This testing checks for missing components. It also identifies any missing solder paste or polarity.The heart of AOI lies in its high-resolution cameras, which accurately scan the boards under test for any discrepancies, missing solder paste or polarity, and quality defects.

ICT (In-Circuit Test): In-circuit testing will check whether a circuit has any shorts or opens. It also ensures that the turnkey PCB assembly is done correctly by checking carious electrical factors. These factors often include resistance, capacitance, and other quantities.

X-Ray Inspection
An X-ray inspection is a non-destructive inspection method that uses radiography and is mainly used to identify CUI (corrosion under insulation). This testing is commonly performed on Quad-flat No-lead (QFN) PCBs and Ball Grid Arrays (BGAs).

Visual inspection
This involves a general quality check of the circuit board.

Solder pastes 3D SPI detector In the production of MCPCB, 3D SPI (Solder Paste Inspection) detectors ensure the accuracy of solder paste deposition on PCBs. Unlike traditional 2D SPI systems, 3D SPI employs advanced imaging techniques to provide a comprehensive three-dimensional analysis of the solder paste application.

Functional testing
This process checks the functionality of the MCPCB. It also ensures that the performance is according to the expectations.

Reliability Testing
Reliability testing is an essential part of MCPCBA product development. Vibration and temperature simulation tests are available in our laboratory.