Aluminium Core PCBs finished copper foil thickness standard

Aluminum substrate finished copper foil thickness standard

The copper foil thickness standard on the finished aluminum substrate is usually expressed in oz (ounces). Common copper foil thicknesses include 1oz, 2oz, 3oz, etc. In the circuit board industry, 1 ounce of copper foil is equivalent to a thickness of approximately 35 microns.

Generally speaking, the copper foil thickness standard on aluminum substrates should comply with relevant international or industry standards, such as IPC-6012 (the quality standard for rigid printed boards established by the American Electronic Industry Standards Association), IEC 62061 (the electronics standard issued by the International Electrotechnical Commission). Component reliability standards), etc.

In actual production, the thickness of the copper foil on the aluminum substrate needs to be selected according to specific applications and requirements to meet the design requirements and performance requirements of the circuit board.

Structure of Aluminum PCBs

Copper Foil Layer
The copper layer used is relatively thicker than normal CCLs ( 1oz-10oz). A thicker layer of copper means a larger current carrying capacity.
Dielectric Layer
The Dielectric layer is a thermally conductive layer and is around 50μm to 200μm thick. It had a low thermal resistance and it suitable for its application.
Aluminum Base
The aluminum base which is made up of aluminum substrate. It has a high thermal conductivity.
Aluminum Base Membrane Layer
Aluminum base membrane is selective. It has a protective role by keeping the aluminum surface safe from scraping and unwanted etching. It is of two types. Lower than 120 degree or around 250 degrees (anti high temperature)

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